At CES 2026, New Jersey-based YPlasma is set to launch the world’s first laptop using plasma-based cooling. The company will debut a laptop cooled using dielectric barrier discharge (DBD) plasma actuators, a solid-state solution designed to replace traditional mechanical fans.
The launch will take place in Las Vegas, where YPlasma aims to demonstrate how this technology enables thinner, quieter, and more efficient devices.
As laptops get thinner and more computationally intensive with AI workloads, there are physical limits that traditional cooling systems are running into. YPlasma claims its DBD plasma actuators solve the problem by generating high-velocity "ionic wind" using cold plasma, without a single moving part.
This approach eliminates the need for fans or conventional ionic wind devices, which often suffer from noise, wear, and reliability.
YPlasma claims this is the first time DBD technology has been miniaturised for consumer electronics. The actuators are paper-thin films, measuring just 200 microns, and can be directly integrated onto heat sinks, chassis walls, or internal components.
This enables ultra-thin laptop designs that, up until now, have been difficult to cool. Unique among actuation technologies, the same actuator can provide both cooling and heating, offering new flexibility in thermal management.
According to YPlasma, the system runs at about 17 dBA, effectively inaudible. Unlike corona discharge systems, which can generate ozone, the company says its dielectric barrier design ensures safe operation in enclosed consumer devices.
The design further ensures the avoidance of tip erosion, a usual point of failure, which will help the system last for the lifetime of the laptop.
YPlasma CEO and Co-Founder David García Pérez said the launch marked a historic moment for the industry, with the firm bringing “space-grade technology” into everyday devices.
Beyond laptops, plasma cooling technology could be applied to vehicles, aircraft, wind turbines, and future space systems, positioning YPlasma as a key player in next-generation thermal solutions.